首页> 外国专利> TEMPERATURE-MEASUREMENT DEVICE FOR SEMICONDUCTORS, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR MEASURING THE TEMPERATURE OF SEMICONDUCTORS DURING ANNEALING PROCESSES

TEMPERATURE-MEASUREMENT DEVICE FOR SEMICONDUCTORS, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR MEASURING THE TEMPERATURE OF SEMICONDUCTORS DURING ANNEALING PROCESSES

机译:半导体的温度测量装置,其制造过程以及在退火过程中测量半导体温度的过程

摘要

A device for measuring the internal temperature of a semiconductor (1) contains an incorporated thermocouple (5). During manufacture of the measurement device, the thermocouple (5) is inserted in a recess (6) in the semiconductor (1) and the recess (6) is filled with a material corresponding to the chemical composition of the surrounding of the recess (6). The measuring device for determining the surface temperature of a semiconductor contains a thermocouple metallized under vacuum on to the surface of a semiconductor or a thermocouple with a supporting weight positioned on the surface of a semiconductor. During the process for measuring the temperature of semiconductors during annealing processes, the temperature of reference semiconductors is determined using these measuring devices. For this purpose a measuring device is annealed together with a reference semiconductor. The invention is applicable to the manufacture of semiconductor products.
机译:用于测量半导体的内部温度的设备(1)包含一个内置的热电偶(5)。在测量设备的制造过程中,将热电偶(5)插入半导体(1)的凹槽(6)中,并在凹槽(6)中填充与凹槽(6)周围的化学成分相对应的材料)。用于确定半导体的表面温度的测量装置包括在真空下金属化到半导体表面上的热电偶或具有位于半导体表面上的支撑重物的热电偶。在退火过程中测量半导体温度的过程中,参考半导体的温度使用这些测量设备确定。为此,将测量设备与参考半导体一起退火。本发明适用于半导体产品的制造。

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