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TEMPERATURE-MEASUREMENT DEVICE FOR SEMICONDUCTORS, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR MEASURING THE TEMPERATURE OF SEMICONDUCTORS DURING ANNEALING PROCESSES
TEMPERATURE-MEASUREMENT DEVICE FOR SEMICONDUCTORS, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR MEASURING THE TEMPERATURE OF SEMICONDUCTORS DURING ANNEALING PROCESSES
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机译:半导体的温度测量装置,其制造过程以及在退火过程中测量半导体温度的过程
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摘要
A device for measuring the internal temperature of a semiconductor (1) contains an incorporated thermocouple (5). During manufacture of the measurement device, the thermocouple (5) is inserted in a recess (6) in the semiconductor (1) and the recess (6) is filled with a material corresponding to the chemical composition of the surrounding of the recess (6). The measuring device for determining the surface temperature of a semiconductor contains a thermocouple metallized under vacuum on to the surface of a semiconductor or a thermocouple with a supporting weight positioned on the surface of a semiconductor. During the process for measuring the temperature of semiconductors during annealing processes, the temperature of reference semiconductors is determined using these measuring devices. For this purpose a measuring device is annealed together with a reference semiconductor. The invention is applicable to the manufacture of semiconductor products.
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