首页>
外国专利>
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE CAPABLE OF SIMPLIFYING MANUFACTURING PROCESSES BY ELIMINATING AN ANNEAL PROCESS AFTER SOURCE/DRAIN IMPURITY IONS ARE IMPLANTED
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE CAPABLE OF SIMPLIFYING MANUFACTURING PROCESSES BY ELIMINATING AN ANNEAL PROCESS AFTER SOURCE/DRAIN IMPURITY IONS ARE IMPLANTED
展开▼
机译:引入了源/漏杂质离子之后消除了退火过程的制造能够简化制造过程的半导体器件的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A method for manufacturing a semiconductor device is provided to perform an annealing process after a silicon film is deposited, thereby simplifying manufacturing processes. ;CONSTITUTION: A gate electrode(130) is formed on a semiconductor substrate and a spacer(150) is formed on both sides of the gate electrode. Impurity ions for forming a source/drain area(160) are implanted onto the surface of the semiconductor substrate of the gate electrode. The semiconductor substrate is loaded on processing equipment so that a silicon oxide film is deposited on the semiconductor substrate.;COPYRIGHT KIPO 2011
展开▼