首页> 外国专利> A process for the preparation of a double diffused metal - oxide - - - semiconductor field effect transistor device, as well as device manufactured by means of this method

A process for the preparation of a double diffused metal - oxide - - - semiconductor field effect transistor device, as well as device manufactured by means of this method

机译:制备双扩散金属-氧化物---半导体场效应晶体管器件的方法,以及用这种方法制造的器件

摘要

A method for manufacturing double-diffused metal-oxide-semiconductor field effect transistor (DMOSFET) device is to form an insulating layer having an opening in top surface on a semiconductor wafer, channel regions and well regions and source regions through two stage diffusions of impurity materials respectively of a different conductivity type from and the same conductivity type as the wafer and carried out through the opening, and further gate, source and drain electrodes are formed after masks provided on a surface area where the drain regions and the source electrode regions that are to be connected to the well regions and source regions and a further ion-implantation of an impurity material of the same conductivity type as the wafer into the channel regions, with the threshold voltage controlled to achieve a depletion type. The channel regions are relatively lower in the carrier concentration than the other parts in the well regions to achieve a high breakdown voltage notwithstanding that the device is of the depletion type.
机译:一种制造双扩散金属氧化物半导体场效应晶体管(DMOSFET)器件的方法是通过杂质的两阶段扩散在半导体晶片,沟道区,阱区和源极区的顶面上形成具有开口的绝缘层。通过该开口分别进行与晶片不同的导电类型和与晶片相同的导电类型的材料,并且在设置有漏区和源电极区的表面区域上设置掩模之后,形成另外的栅,源和漏电极。将其与阱区和源极区连接,并且将与晶片具有相同导电类型的杂质材料进一步离子注入到沟道区中,并控制阈值电压以实现耗尽型。尽管该器件是耗尽型的,但是沟道区的载流子浓度比阱区中的其他部分低,以实现高击穿电压。

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