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Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby
Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby
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机译:形成用于结合高密度集成电路的部件的多层金属网络的方法以及由此产生的集成电路
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摘要
A method of forming a planarization layer over a multilayered metal network which interconnects the components of a high-density integrated circuit and which includes conductors having steep edges disposed over a substrate. A layer of spin-on-glass is applied over the lower metal layer so as to have a thickness substantially equal to that of the lower metal layer and to form a thin film over the conductors. The spin-on-glass layer is uniformly etched to expose the upper surfaces of the conductors, and a dielectric layer is applied onto the etched spin-on- glass layer and upper surfaces of the conductors.
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