PURPOSE:To improve the reliability to resist deterioration by adhering two sheets of magnetic material plates, then packing a conductive material into cut grooves to attain a conducting state. CONSTITUTION:Winding grooves 5 and glass grooves 7 are formed on the ferrite plate 1 and track width regulating grooves 9 are worked on the ferrite plates 1, 3 in the direction perpendicular thereto. After a gap film is formed on the ferrite plate 1, the ferrite plates 1, 3 are superposed on each other and fine glass wires are inserted into the glass grooves 7 and are melted by heating; thereafter, the ferrite plates 1, 3 are cooled and are thereby adhered. The glass melts at this time and is penetrated by capillarity between the ferrite plates 1 and 3. Since the glass grooves 7 are hollowed, solder wires 17 are inserted therein, are heated by a heating treatment device 18 and are cooled by which the solder 19 is packed into the glass grooves 7. The parts h1 and h3 of a ferrite chip 21 are conducted by the solder 19 packed into the cavity part h4 and the electrification of the part h3 does not arise. The roughening of the sliding sur face around the gap and the degradation in the electrical output are prevented in this way.
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