首页> 外国专利> Pattern formation manner, production manner of the micro device, production manner of the thin film magnetic head, production manner of the magnetic head slider and production manner of the magnetic head device, being the pattern formation manner which forms the resist

Pattern formation manner, production manner of the micro device, production manner of the thin film magnetic head, production manner of the magnetic head slider and production manner of the magnetic head device, being the pattern formation manner which forms the resist

机译:图案形成方式,微器件的制造方式,薄膜磁头的制造方式,磁头滑块的制造方式和磁头装置的制造方式是形成抗蚀剂的图案形成方式。

摘要

A metal film made of a metal material (e.g., NiFe, CoFeNi, or FeCo) including an iron atom is formed on a substrate (S 101 ). Subsequently, the metal film formed on the substrate is plasma-processed in an environment including a gas (e.g., an oxygen gas having a tetrafluoromethane or trifluoromethane gas added thereto) containing oxygen and fluorine atoms (S 103 ). Then, a resist material (e.g., a chemically amplified positive resist material) is applied onto the plasma-processed metal film, so as to form a resist film (S 105 ). Thereafter, the resist film is partly removed, so as to expose a part of the surface of metal film in conformity to a desirable pattern, thereby forming a resist frame (S 107 ).
机译:在基板上形成由包括铁原子的金属材料(例如,NiFe,CoFeNi或FeCo)制成的金属膜(S 101)。随后,在包括含有氧和氟原子的气体(例如,向其中添加了四氟甲烷或三氟甲烷气体的氧气)的环境中,对在基板上形成的金属膜进行等离子体处理(S 103)。然后,将抗蚀剂材料(例如,化学放大的正抗蚀剂材料)施加到等离子体处理的金属膜上,以形成抗蚀剂膜(S 105)。此后,部分地去除抗蚀剂膜,以使金属膜的表面的一部分符合期望的图案,从而形成抗蚀剂框架(S 107)。

著录项

  • 公开/公告号JP3867017B2

    专利类型

  • 公开/公告日2007-01-10

    原文格式PDF

  • 申请/专利权人 TDK株式会社;

    申请/专利号JP20020151339

  • 发明设计人 上島 聡史;

    申请日2002-05-24

  • 分类号G03F7/09;G03F7/40;G11B5/31;

  • 国家 JP

  • 入库时间 2022-08-21 21:07:24

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