TIN-OR SOLDER-PLATED COPPER OR COPPER-ALLOY MATERIAL EXCELLENT IN THERMAL PEELING RESISTANCE

摘要

PURPOSE:To manufacture a plated coppery material excellent in thermal peeling resistance by applying dull tinning, etc., to a coppery base material and then brightening the above by means of rolling working at a specific draft. CONSTITUTION:The surface of a base material composed of copper or copper alloy is subjected to degreasing treatment by the conventional method and subjected, if necessary, to undercoat copper plating, and then, dull or semi-bright tinning or solder plating is applied to the above to about 1-10mu thickness. Subsequently, the above plated base material is subjected to rolling working at 0.5-10% draft to undergo brightening. By this method, the formation of intermetallic compound is inhibited, and as a result, the adhesive strength between the base material and the plating is improved and the occurrence of thermal peeling is prevented, by which the coppery material useful as material for electronic parts can be obtained.