COPPER OR COPPER ALLOY MATERIAL COATED WITH TIN OR SOLDER PLATING EXCELLENT IN THERMAL PEELING RESISTANCE

摘要

PURPOSE:To produce copper-based material coated with plating excellent in thermal peeling resistance by coating the copper-based base body with tin or solder plating so that carbon amount is specified. CONSTITUTION:After a base body made of copper or copper alloy is degreased by an ordinary method, copper substrate plating is performed in accordance with necessity and the base body is coated with tin or solder plating so that carbon amount is regulated to =0.1wt.% and plating thickness is regulated to about 1-10mum. Further in order to lower carbon amount to =0.1wt.%, a brightener of plating liquid is reduced or plating is performed at extremely low current density. Therefor when gloss is necessitated, plating regulated to =0.1wt.% carbon amount is provided at thickness not smaller than 10% of the whole plating coated thickness and thereafter glossy tin or solder plating is performed. Thereby the copper-based material coated by plating which is improved in peeling resistance is formed and availably utilized as electron parts material.