COPPER OR COPPER ALLOY MATERIAL PLATED WITH TIN OR SOLDER REFLOWED AND EXCELLENT IN THERMAL PEELING RESISTANCE

摘要

PURPOSE:To produce plated copper-based material excellent in thermal peeling resistance and solderability by successively providing both a plated zinc-based layer and a plated copper layer having specified thickness on the surface of the copper-based base body and thereafter providing a layer plated with tin or solder and performing reflowing treatment. CONSTITUTION:After a base body made of copper or copper alloy is degreased by an ordinary method, a plated zinc or zinc alloy layer of 0.1-0.5mum thickness is formed on the surface thereof as a substrate layer. Then a plated copper layer of 0.2-5mum thickness is formed on the plated zinc or zinc alloy layer and furthermore a plating layer of tin or solder having about 0.2-3mum thickness is formed on this plated copper layer and thereafter reflowing treatment is performed by an ordinary method. Thereby formation of an intermetallic compd. is inhibited and generation of a void is reduced and the plated layer is prevented from being thermally peeled and the plated copper-based material is availably utilized as electron parts material.