Laminates are provided of at least one polynorbornene prepreg comprising a substrate coated with a polynorbornene secured to a conductive surface, such as copper having an etched matte texture thereon. Adhesion between the polynorbornene prepreg and the conductive surface is improved by coating the conducting surface with as silane coupling agent and/or by providing polyolefin film therebetween. To improve or reduce the dielectric constant, polyolefin powder can be placed in the dipping bath in the preparation of polynorbornene prepregs. Epoxy prepreg can also be incorporated into the laminates. Multi-layer laminates can be provided of alternating or non-alternating epoxy prepregs and polynorbornene prepregs. The prepregs are made by a process which includes an adhesion promotion step wherein the prepreg, preferably polynorbornene prepreg, prior to lamination, is pretreated with a silane adhesion promotion agent. One or more copper foils can also be employed between exterior surfaces of the prepregs, at the interface between the prepregs, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.
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