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Si-GaP-Si heterojunction bipolar transistor (HBT) on Si substrate

机译:Si衬底上的Si-GaP-Si异质结双极晶体管(HBT)

摘要

A heterojunction bipolar transistor (HBT) is provided having a silicon substrate in which a conventional junction base is formed. A coherently strained layer of semiconductor material having a wider band gap than silicon, such as gallium phosphide, is formed over the base to form a first portion of an emitter multilayer. A second portion of the emitter multilayer comprises silicon which can be epitaxially grown on the coherently strained layer. A thin heteropotential barrier is thus formed at the base-emitter junction which preferentially allows electrons to move from emitter to base while significantly reducing hole current from base to emitter, thereby improving emitter injection efficiency and current gain.
机译:提供了具有硅衬底的异质结双极晶体管(HBT),其中形成有常规的结基极。具有比硅更宽的带隙的半导体材料的相干应变层,例如磷化镓,形成在基底上方,以形成发射极多层的第一部分。发射极多层的第二部分包括可以在相干应变层上外延生长的硅。因此,在基极-发射极结处形成了一个薄的异质势垒,它可以优先使电子从发射极移动到基极,同时显着降低从基极到发射极的空穴电流,从而提高发射极注入效率和电流增益。

著录项

  • 公开/公告号US4959702A

    专利类型

  • 公开/公告日1990-09-25

    原文格式PDF

  • 申请/专利权人 MOTOROLA INC.;

    申请/专利号US19890417417

  • 发明设计人 CURTIS D. MOYER;RAYMOND K. TSUI;

    申请日1989-10-05

  • 分类号H01L29/72;H01L29/161;H01L29/80;

  • 国家 US

  • 入库时间 2022-08-22 06:06:55

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