首页> 外国专利> Method of manufacturing a semiconductor device, in which a negative image is formed on a semiconductor substrate in a positive photolacquer

Method of manufacturing a semiconductor device, in which a negative image is formed on a semiconductor substrate in a positive photolacquer

机译:制造半导体器件的方法,其中在正光漆中在半导体衬底上形成负像

摘要

A method of manufacturing a semiconductor device, in which a layer of photolacquer (5) containing as a photoactive component a diazo oxide is provided on a semiconductor substrate. Of this layer, parts (9) are irradiated by a first patterned irradiation (7) and these parts are then rendered poorly developable by an intermediate treatment. Subsequently, the lacquer layer (5) is subjected to a second non-patterned irra­diation (11) and is then developed. According to the invention, in the parts (9) irradiated by the first irradiation a pigment is formed, which absorbs radiation having a wavelength at which diazo oxide is photosen­sitive. The second irradiation is carried out with radiation of that wavelength. Thus, lacquer tracks having a rectangular profile can be obtained in a simple manner.
机译:一种制造半导体器件的方法,其中在半导体衬底上提供一层包含重氮氧化物作为光敏组分的光漆(5)。在该层中,通过第一图案化辐射(7)来辐射部件(9),然后通过中间处理使这些部件难以显影。随后,对漆层(5)进行第二次非图案照射(11),然后显影。根据本发明,在通过第一辐射照射的部分(9)中,形成颜料,该颜料吸收具有重氮氧化物为光敏性的波长的辐射。用该波长的辐射进行第二次辐射。因此,可以以简单的方式获得具有矩形轮廓的漆道。

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