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method of producing a pmos - knowledge, and according to this procedure are pmos transistor

机译:生产pmos的方法-知识,并根据此程序是pmos晶体管

摘要

A process is disclosed for producing a PMOS-transistor (1) in a p-doped substrate (2). A n-doped trough (4) is produced by implantation, then by diffusion, the transistor (1) is insulated with a field oxide layer (14) and the transistor gate is produced by photolithographically patterning a layer. The photosensitive resist that remains from the gate etching by photolithographic patterning is used to mask the drain area at the extremity on the gate side, for at least one p?--implantation. A falling edge to the surface of the drain area is generated in the layer of photoresist (22) at the gate edge (11). The falling edge deviates the flank (17, 19) of the implantation concentration profile (16, 18) towards the channel located under the gate area (12) when the implantation is introduced.
机译:公开了一种在p掺杂衬底(2)中生产PMOS晶体管(1)的方法。通过注入产生n掺杂的沟槽(4),然后通过扩散产生,晶体管(1)与场氧化物层(14)绝缘,并且通过对层进行光刻图案化来产生晶体管栅极。通过光刻构图从栅极蚀刻中残留的光敏抗蚀剂被用于掩盖栅极侧末端的漏极区域,至少进行一次p-注入。在栅极边缘(11)处的光致抗蚀剂层(22)中产生了漏极区域表面的下降边缘。当引入注入时,下降边缘使注入浓度分布图(16、18)的侧面(17、19)朝着位于浇口区域(12)下方的通道偏离。

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