首页> 外国专利> Method of manufacturing a structure integrated guide - sensor application in a semi - conductive material.

Method of manufacturing a structure integrated guide - sensor application in a semi - conductive material.

机译:在半导体材料中制造结构集成的导向传感器的方法。

摘要

This method consists in epitaxially growing, on a semiconductor (2, 1), a lower semiconductor confinement layer (4), a semiconductor guide layer (6) and an upper semiconductor confinement layer (8), of like conductivity type, the guide layer interposed between the confinement layers having a forbidden energy band lower than that of the confinement layers, in etching the upper layer to form a guide-ribbon one end of which defines a first step (12), the latter terminating in a lateral widening (28a) in a plane parallel to the epitaxially-grown layers, in etching the cleared guide layer to form a second step (16) adjacent to the first step, in epitaxially growing a detector semiconductor layer (18) of this conductivity type, whose forbidden energy band is lower than that of the confinement layers and of the guide layer, in removing the portion of the detector layer covering the guide-strip, and in forming the detector in the detector layer, opposite the steps so as to produce an end-coupling between the guide layer and the detector. …IMAGE…
机译:该方法包括在半导体(2,1)上外延生长具有类似导电类型的下半导体限制层(4),半导体引导层(6)和上半导体限制层(8),该引导层在刻蚀上层以形成导向带的过程中,在禁带之间的禁带比禁带层的禁带低,禁带的一端限定了第一台阶(12),该台阶终止于横向加宽(28a) )在平行于外延生长层的平面中,在蚀刻清除的引导层以形成与第一步相邻的第二步(16)的过程中,外延生长这种导电类型的探测器半导体层(18),其禁能在去除检测器层的覆盖引导条的部分和在检测器层中形成检测器时,与步骤相反,从而产生端耦合,该带的宽度小于限制层和引导层的带。在引导层和检测器之间。 …<图像>…

著录项

  • 公开/公告号FR2662304B1

    专利类型

  • 公开/公告日1992-07-24

    原文格式PDF

  • 申请/专利权人 FRANCE TELECOM;

    申请/专利号FR19900006317

  • 申请日1990-05-21

  • 分类号H01L31/18;

  • 国家 FR

  • 入库时间 2022-08-22 05:24:50

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