Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding

摘要

A semiconductor device (20) has a plurality of TAB leads (28) which facilitate lead bonding. The device is comprised of a semiconductor die (22) having a plurality of bonding pads (24) located thereon. On each of the bonding pads is a bump (26). Bonded to each of the bumps is a TAB lead (28) which has a recessed portion, such as a hole (30). The recessed portion or hole is placed over a protrusion of the bump, for example a tail of a ball bump, such that the lead is guided into the appropriate position relative to the bump during lead bonding, thereby preventing misalignment. The presence of the recessed portion in the lead also eliminates the need to flatten bumps prior to lead bonding.