METHOD AND DEVICE FOR SCANNING LASER BEAM FOR INSPECTION OF SEMICONDUCTOR WAFER SURFACE

摘要

An apparatus for scanning a laser beam to examine the surface of a semiconductor wafer comprises a stage (20) onto which a semiconductor wafer (11) is mounted and a laser beam scanning unit (26, 28, 30) for repeatedly rectilinearly scanning a laser beam in a predetermind direction on the semiconductor wafer (11). This scanning apparatus further has a drive unit (22, 24, 33) for rotating the semiconductor wafer (11) and for moving the semiconductor wafer (11) by only a predetermined distance in the predetermined direction every rotation of the wafer. The laser beam scanning unit (26, 28, 30) rectilinearly scans the laser beam at a swing width of a predetermined amount.