METHOD AND EQUIPMENT FOR SAWING BRITTLE AND HARD MATERIAL, ESPECIALLY THE ONE OF AT LEAST 200MM IN DIAMETER

摘要

PURPOSE: To surely prevent damages in the center of an ingot or wafer at the time of sawing. ;CONSTITUTION: When a wafer 6 from a workpiece made by flat-polishing an end face of an ingot is sawn, the workpiece is first sawn to a residual connection by means of a ring saw 2. To completely separate a wafer from the ingot, the residual cutting technology is used, wherein a projection is left over at the center of the ingot or wafer. Twist separation and separation by a wire saw 15 are the most appropriate methods for this technology. The final process includes the elimination of the projection on the wafer by rotary polishing. This method is especially suitable for a crystal having at least 200mm diameter.;COPYRIGHT: (C)1993,JPO