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Sawing device for sawing of a workpiece of hard brittle material

机译:用于锯切硬质脆性材料的工件的锯切装置

摘要

Sawing device (1) for sawing of a workpiece (14) made of hard brittle material, in particular for sawing of crystals, with a sawing assembly (16), comprising a plurality of extending in parallel next to one another by means (4) for the simultaneous separation of a plurality of discs (46) of the workpiece (14) and a plurality of extending in parallel next to one another grinding tools (6) for the purpose of subsequent processing of the cut surfaces (46a, 46b), wherein the saws (4) and the grinding tools (6) are arranged one behind the other in pairs.
机译:用于锯切由硬质脆性材料制成的工件(14),特别是用于锯切晶体的锯切装置(1),具有锯切组件(16),该锯切组件包括多个彼此平行延伸的装置(4)用于同时分离工件(14)的多个圆盘(46)和多个彼此平行并平行延伸的磨削工具(6),以便随后加工切割面(46a,46b),其中,锯子(4)和研磨工具(6)成对地彼此后排布置。

著录项

  • 公开/公告号DE102004013038B4

    专利类型

  • 公开/公告日2006-10-12

    原文格式PDF

  • 申请/专利权人 AJINEH MAHMOUD 55743 IDAR-OBERSTEIN DE;

    申请/专利号DE20041013038

  • 发明设计人 GLEICH PATENTINHABER;

    申请日2004-03-16

  • 分类号B28D1/02;

  • 国家 DE

  • 入库时间 2022-08-21 21:21:00

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