Method for cutting wafers from workpieces of brittle material using diamond wire saws has several workpieces on a rotating mount to enhance the cutting action

摘要

A method for cutting wafers from rods or crystal of brittle material, e.g. semiconductor crystal, has two or more workpieces on a rotating mount offered up to a diamond saw with a number of parallel wires. The workpiece holder rotates about a central axis (1) and is fitted to an indexing drive (6) to feed the workpieces onto the saw. The overall cutting action is a combination of the reciprocating saw drive as well as the work holder rotating drive.