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GAAS ON-SI HETERO-EPITAXIAL SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

机译:GAAS ON-SI异质半导体器件及其制造

摘要

PURPOSE: To provide a mesa delamination/deposition (MRD) method, through which stress is removed from a GaAs layer on Si. ;CONSTITUTION: An AlAs thin layer 16 is built in a hetero-epitaxial GaAs layer 14, 1 μm or so apart from a GaAs layer/Si interface. Then, a GaAs mesa is formed by etching and under-etched in a 5% HF etching solution at a room temperature. At this point, the mesas are precisely held at prescribed positions by a photoresist clamp 18 and deposited on a substrate again as being self- aligned, after the clamp 18 has been removed. Before and after an MRD process is carried out, the GaAs layer 14 on Si is analyzed spatially by photoluminescence to ascertain whether or not stress is removed. Then, a GaAs epitaxy layer 14 is grown on the GaAs-on-Si12 mesa.;COPYRIGHT: (C)1993,JPO
机译:目的:提供一种台面分层/沉积(MRD)方法,通过该方法可以消除Si上GaAs层中的应力。组成:AlAs薄层16建在异质外延GaAs层14中,与GaAs层/ Si界面相距约1μm。然后,通过蚀刻形成GaAs台面,并在室温下在5%HF蚀刻溶液中进行蚀刻不足。此时,台面被光致抗蚀剂夹具18精确地保持在预定位置,并且在夹具18已被移除之后再次以自对准的方式再次沉积在基板上。在执行MRD工艺之前和之后,通过光致发光对Si上的GaAs层14进行空间分析,以确定是否消除了应力。然后,在GaAs-on-Si12台面上生长GaAs外延层14。版权所有:(C)1993,JPO

著录项

  • 公开/公告号JPH05160156A

    专利类型

  • 公开/公告日1993-06-25

    原文格式PDF

  • 申请/专利权人 INTERUNIV MICRO ELECTRO CENTRUM VZW;

    申请/专利号JP19910163018

  • 发明设计人 JOHANN TEOFIEL MARIA DEBUKE;

    申请日1991-07-03

  • 分类号H01L21/338;H01L29/812;H01L21/02;H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-22 05:15:41

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