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a multiple semiconductor devices for high requirements of applications mehrschichtenverbindungssystem information packaging.
a multiple semiconductor devices for high requirements of applications mehrschichtenverbindungssystem information packaging.
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机译:满足高要求应用的多种半导体器件,用于信息系统包装。
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摘要
A method for fabricating a multilayer interconnection system that is fully planar with completely sealed and corrosion resistant conductors separated by dielectric material.
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