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Current Topics in Electronic Devices Based on Wide Band-Gap Semiconductors for Power Applications and Energy Efficiency

机译:基于宽带间隙半导体的电子设备的当前主题用于电力应用和能效

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Wide-bandgap power semiconductor devices offer enormous energy efficiency gains in a wide range of potential applications. As silicon-based semiconductors are fast approaching their performance limits for high power requirements, gallium nitride (GaN), silicon carbide (SiC), and diamond, with their superior electrical properties are likely candidates to replace silicon in the near future. Along with higher blocking voltages wide-bandgap semiconductors offer breakthrough relative circuit performance enabling low losses, high switching frequencies, and high temperature operation. The progress of the development of high voltage, high current wide-bandgap power switching devices in the ARPA-E SWITCHES program is reviewed. The performance of various rectifiers and transistors, which have been demonstrated, is discussed. Material and processing challenges and reliability concerns for wide-bandgap power devices are also described. A glimpse into the future trends in device development and commercialization is offered.
机译:宽带隙功率半导体器件在广泛的潜在应用中提供巨大的能效增益。由于硅基半导体快速接近其对高功率要求的性能限制,氮化镓(GaN),碳化硅(SiC)和钻石具有优异的电气性质,可能是在不久的将来取代硅的候选者。随着较高的阻塞电压宽带隙半导体提供突破性的相对电路性能,从而实现低损耗,高开关频率和高温操作。综述了ARPA-E交换机程序中的高电压,高电流宽带隙功率开关装置的开发进展。讨论了已经证明的各种整流器和晶体管的性能。还描述了宽带隙功率器件的材料和处理挑战和可靠性问题。提供了一瞥未来的设备开发和商业化趋势。

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