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INTEGRATED-CIRCUIT PACKAGE CONFIGURATION FOR PACKAGING AN INTEGRATED-CIRCUIT DIE AND METHOD OF PACKAGING AN INTEGRATED-CIRCUIT DIE
INTEGRATED-CIRCUIT PACKAGE CONFIGURATION FOR PACKAGING AN INTEGRATED-CIRCUIT DIE AND METHOD OF PACKAGING AN INTEGRATED-CIRCUIT DIE
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机译:用于封装集成电路芯片的集成电路封装配置和用于封装集成电路芯片的方法
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摘要
A package design configuration for an integrated-circuit die (104) includes a leadframe having its bonding fingers (106) connected to the periphery of an electrically-insulated, heat-conductive substrate (102), formed, for example, of a ceramic material. A number of electrically conductive traces (110), or bonding islands, serve as intermediate bonding locations for shorter bonding wires (112, 116) connecting bonding pads (114) on the integrated-circuit die (104) to the bonding fingers (106) of the leadframe. The integrated-circuit die overlies the conductive traces while still providing an exposed portion of the conductive traces as a respective intermediate attachment area for respective bonding wires. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques.
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