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A process for the distribution of the load on a circuit board or on a connection package having in each case of a plurality of wiring planes.
A process for the distribution of the load on a circuit board or on a connection package having in each case of a plurality of wiring planes.
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机译:一种将负载分配在电路板或连接封装上的方法,该负载分别具有多个布线平面。
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摘要
A method for distributing wire load among the layers of a multilayer interconnection package such that in each region of the package, the wire load is balanced among all layers and such that specified subsets of two-pin connections may be constrained to lie within the same layer.
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