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Method for fabricating a semiconductor laser device in which the P-type clad layer and the active layer are grown at different rates

机译:P型覆层和有源层以不同的速率生长的半导体激光器件的制造方法

摘要

A method for fabricating a semiconductor laser device wherein a first clad layer is formed on a GaAs monocrystal substrate of one conductivity type. The first clad layer is made of a compound semiconductor of one conductivity type represented by the formula, (Al. sub.x Ga.sub.1-x).sub.0. 5 In.sub.0.5 P, wherein 0.4 ≦X≦1. Then, an active layer of a compound semiconductor of the formula. (Al.sub.y Ga.sub. 1-y).sub.0.5 In. sub.0.5 P, wherein 0≦y≦0.35 is formed on the first clad layer, on which a second clad layer of a compound semiconductor of the other conductivity type represented by the formula defined with respect to the first clad layer. At least one of the first and second clad layers is epitaxially grown at a rate of not larger than 0.5 &mgr; m/hour sufficient to form a monolayer superlattice structure therein and the active layer is epitaxially grown at a rate of not less than 2.0 &mgr; m/hour.
机译:一种制造半导体激光器件的方法,其中在一个导电类型的GaAs单晶衬底上形成第一覆盖层。第一覆盖层由式(Al x Ga 1-x)0表示的一种导电类型的化合物半导体制成。 5 In.sub.0.5 P,其中0.4≦ X≦ 1。然后,是下式的化合物半导体的活性层。 (Al.sub.ga Ga.sub.1-y).sub.0.5 In。 sub.0.5 P,其中在第一覆层上形成0-1E; y≦ 0.35,在其上由相对于第一覆层定义的式表示的另一种导电类型的化合物半导体的第二覆层。第一和第二包覆层中的至少一个以不大于0.5μg的速率外延生长。 m /小时足以在其中形成单层超晶格结构,并且有源层以不小于2.0μg的速率外延生长。米/小时。

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