The feature of the construction of this invention lies in a direct bond copper (DBC) pate. That is, a first Cu plate on which a semiconductor pellet is formed is fixed on the ceramic plate to continuously extend from the front surface of the ceramic plate to the rear surface thereof via one side surface thereof. Second Cu plates serving as electrodes of the semiconductor pellet are fixed on both sides of the Cu plate on the surface of the ceramic plate on which the semiconductor pellet is disposed. Electrode pads formed on the semiconductor pellet fixed on the first Cu plate are electrically connected to the second Cu plates by means of bonding wires. Since the the first Cu plate is continuously formed on the rear surface of the ceramic plate which is opposite to the surface on which the semiconductor pellet is mounted, the fixation surface of the semiconductor pellet is electrically connected to a heat sink plate.
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