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Process for the rapid thermal annealing of a semiconductor wafer using irradiation

机译:使用辐射对半导体晶片进行快速热退火的方法

摘要

The process for the rapid thermal annealing of a semiconductor wafer using electromagnetic irradiation by means of an irradiation system for heating the semiconductor wafer (1), which is preferably surrounded by a quartz chamber, envisages using an irradiation system, in particular a reflector system, which is designed so as to ensure that, when the process is carried out, the semiconductor wafer (1) is irradiated in such a way that an equal temperature is achieved in the central (6) and peripheral region (5) of the semiconductor wafer (1) by means of an intensity distribution of the light and of the heat radiation from the semiconductor wafer (1), which intensity distribution is inherently homogeneous in each case across the semiconductor wafer (1). The process is used to improve rapid thermal annealing in the production of semiconductor integrated circuits. IMAGE
机译:设想借助于电磁辐射通过用于加热半导体晶片(1)的辐射系统进行电磁晶片的快速热退火的方法,该辐射系统优选地被石英腔包围,该方法考虑使用辐射系统,特别是反射器系统,其被设计成确保在执行该过程时以这样的方式照射半导体晶片(1),使得在半导体晶片的中心(6)和外围区域(5)中达到相等的温度(1)借助于来自半导体晶片(1)的光和热辐射的强度分布,该强度分布在每种情况下在整个半导体晶片(1)上固有地是均匀的。该方法用于改善半导体集成电路生产中的快速热退火。 <图像>

著录项

  • 公开/公告号EP0505928A3

    专利类型

  • 公开/公告日1994-08-17

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号EP19920104811

  • 发明设计人 KAKOSCHKE RONALD DR. RER. NAT.;

    申请日1992-03-19

  • 分类号H01L21/268;H01L21/00;

  • 国家 EP

  • 入库时间 2022-08-22 04:39:36

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