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Comparison of Poly-Si Thin Films Prepared by Conventional Furnace Annealing and Pulsed Rapid Thermal Annealing

机译:常规炉退火和脉冲快速热退火制备的多晶硅薄膜的比较

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摘要

Amorphous silicon films prepared by PECVD on glass substrate were crystallized by conventional furnace annealing (FA) and rapid thermal annealing ( RTA),respectively. From the Raman spectra and scanning electronic microscope(SEM),it found that the thin films made by RTA had smooth and perfect structure,while the thin films annealed by FA had a higher degree of structural disorder.
机译:通过PECVD在玻璃基板上制备的非晶硅膜分别通过常规的炉内退火(FA)和快速热退火(RTA)进行结晶。从拉曼光谱和扫描电子显微镜(SEM)可以看出,RTA制备的薄膜具有光滑而完美的结构,而FA退火的薄膜具有较高的结构无序度。

著录项

  • 来源
    《半导体光子学与技术(英文版)》 |2009年第2期|117-119|共3页
  • 作者单位

    Nanyang Institute of Technology,Nanyang 473004,CHN;

    Key Laboratory of Material Physics of the Ministry of Education of China,Zhengzhou University,Zhengzhou 450052,CHN;

    Nanyang Institute of Technology,Nanyang 473004,CHN;

    Nanyang Institute of Technology,Nanyang 473004,CHN;

    Nanyang Institute of Technology,Nanyang 473004,CHN;

    Nanyang Institute of Technology,Nanyang 473004,CHN;

    Key Laboratory of Material Physics of the Ministry of Education of China,Zhengzhou University,Zhengzhou 450052,CHN;

  • 收录信息 中国科学引文数据库(CSCD);
  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 TN304.05;
  • 关键词

  • 入库时间 2022-08-19 03:40:57
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