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Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
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机译:通过焊料模片粘合剂附着到多芯片模块的半导体芯片的自对准和平面化工艺
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摘要
A method for attaching a chip to a substrate includes providing the substrate with an outer layer of an electrical conductor which is not wettable by solder and which has a window exposing an inner layer of electrical conductor that is wettable by solder. A solder preform is placed on the window exposing the inner layer, and the chip is placed on the solder preform. The substrate is then heated so as to melt the solder preform. To achieve planarity, the substrate is be positioned in a pressurizing chamber with a film overlay having higher pressure above the film overlay than underneath the overlay, and heated above the melting point of the solder.
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