PURPOSE: To perform a splitting process in a fully-automated state by carrying a wafer to a splitting means which splits the wafer into individual chips after taking out the wafer to a wafer carrying area and returning the split wafer to the wafer carrying area, and then, housing the split wafer to the original position in a cassette. ;CONSTITUTION: A wafer W taken out to a carrying area 6 is carried to a splitting means 9. The wafer carrying means which has carried the wafer W to the means 9 returns the wafer W to the position of the wafer W before carrying, namely, to a carrying area 6 after splitting the wafer W. A splitting mechanism 10 which splits the wafer W into individual chips while the wafer W is fixed by means of clamping pieces 9c is provided in a cylindrical main body 9a of the means 9. Thereafter, a wafer carrying-in means 17 houses the split wafer W to the original position in a cassette 2 by clamping a frame F.;COPYRIGHT: (C)1995,JPO
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