SINGLE WAFER CLEANING SYSTEM

摘要

PURPOSE: To allow scrubber cleaning of a wafer to which abrasives are adhering after polishing without causing any damage. ;CONSTITUTION: A section 10 for sustaining a wafer in wet state is interposed between a scrubber cleaning section 8 and a section for carrying in the wafer. A section 17 for showering pure water on the wafer, and a section 27 for brushing the wafer using a chemical detergent are disposed in the section 10. Adhesives adhering to the wafer are removed before the wafer reaches the scrubber cleaning section.;COPYRIGHT: (C)1995,JPO