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Shape-simulation method, which allows simulation of a prepared shape during steps for producing a semiconductor device in a short time period

机译:形状模拟方法,允许在短时间内生产半导体器件的步骤中模拟准备好的形状

摘要

A region, to which a volume ratio "1" is allocated in an analysis region (100a), is divided into a first and a second type of cells (C3, C4). A third cell (C1) is arranged in immediate proximity to and above the first cell (C3), and the volume ratio "0" is allocated to the third cell (C1). Relative to the direction in which the third and the first cells (C1, C3) are arranged in immediate proximity to each other, the two cells (C1, C3) are matched in such a way that they have the same width. By interpolation of the volume ratio, the result gives the position, at which the volume ratio 0.5 occurs, at the boundary between the cells (C3, C1). IMAGE
机译:在分析区域(100a)中分配有体积比“ 1”的区域被划分为第一类型的单元格和第二类型的单元格(C3,C4)。第三单元(C1)紧邻第一单元(C3)并在其上方布置,并且体积比“ 0”分配给第三单元(C1)。相对于第三和第一单元(C1,C3)彼此紧邻布置的方向,两个单元(C1,C3)以它们具有相同的宽度的方式匹配。通过对体积比进行插值,结果可得出在单元格(C3,C1)之间的边界处发生体积比0.5的位置。 <图像>

著录项

  • 公开/公告号DE4433523A1

    专利类型

  • 公开/公告日1995-03-23

    原文格式PDF

  • 申请/专利权人 MITSUBISHI DENKI K.K. TOKIO/TOKYO JP;

    申请/专利号DE19944433523

  • 发明设计人 FUJINAGA MASATO ITAMI HYOGO JP;

    申请日1994-09-20

  • 分类号H01L21/66;H01L21/306;H01L21/20;

  • 国家 DE

  • 入库时间 2022-08-22 04:08:48

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