A shape simulation method capable of simulating a machining shape in a short time in a manufacturing process of a semiconductor device

摘要

The area assigned the volume "1" in the analysis area 100a is divided into the first and second kinds of cells C3 and C4 and the third cell C1 is divided into the first cell C3 And the volume ratio " 0 " is assigned to the third cell C1.;The cells C 1 and C 3 are arranged to have the same width with respect to the direction in which the third and first cells C 1 and C 3 are adjacent to each other.;As a result, by the interpolation calculation of the volume ratio, the position where the volume ratio is 0.5 at the boundary between the cells C3 and C1 is determined.