Electroless deposition of nickel on surfaces such as copper or molten tungsten.

摘要

Conductive surfaces such as copper and/or tungstensurfaces, particularly copper circuitry areas of printedcircuit board substrates or fused tungsten circuitryareas of fused tungsten-ceramic packages, are activatedfor receipt of electroless nickel plating thereon byproviding the surfaces with particulate zinc metal,particularly by contact of the surfaces with an aqueoussuspension of particulate zinc metal.