Electroless nickel plating of surfaces such as copper or fused tungsten.

摘要

Conductive surfaces such as copper and / or surfaces TUNGSTEN, PARTICULARLY AREAS Circuitry COPPER SUBSTRATES PRINTED CIRCUIT BOARD OR AREAS OF Circuitry FADE tungsten, ceramic packages TUNGSTEN FUSED, are activated to receive on a coating of nickel NO ELECTRIC TYPE THROUGH GIVING METAL SURFACES WITH ZINC particulate CONTACT SURFACES PARTICULARLY WITH METAL an aqueous slurry of particulate zinc.