首页> 外国专利> Method for manufacturing a semiconductor device comprising metal-oxide-semiconductor field effect transistors.

Method for manufacturing a semiconductor device comprising metal-oxide-semiconductor field effect transistors.

机译:制造包括金属氧化物半导体场效应晶体管的半导体器件的方法。

摘要

The invention relates to a method for manufacturing a semiconductor device comprising MOSFETs, which comprises the steps of forming an antioxidant film pattern (4) over an element forming region of a semiconductor substrate (1), selectively oxidizing a region not covered by the antioxidant film pattern on the semiconductor substrate to form an insulating oxide film (7), and implanting impurities in the semiconductor substrate through the insulation oxide film and the antioxidant film with a predetermined acceleration energy, to form a threshold voltage control region (12b, 16b) under the antioxidant film and a stop region of channel (12a, 16a) under the insulation oxide film. The channel stop region and the threshold voltage control region can be formed using a single ion implantation process.
机译:本发明涉及一种用于制造包括MOSFET的半导体器件的方法,该方法包括以下步骤:在半导体衬底(1)的元件形成区域上方形成抗氧化膜图案(4),选择性地氧化未被抗氧化膜覆盖的区域。在半导体衬底上构图以形成绝缘氧化膜(7),并以预定的加速能量通过绝缘氧化膜和抗氧化膜向半导体衬底中注入杂质,以在半导体衬底上形成阈值电压控制区(12b,16b)。抗氧化剂膜和绝缘氧化膜下方的沟道(12a,16a)的终止区域。可以使用单个离子注入工艺来形成沟道停止区和阈值电压控制区。

著录项

  • 公开/公告号FR2714525A1

    专利类型

  • 公开/公告日1995-06-30

    原文格式PDF

  • 申请/专利权人 FUJITSU LIMITED;

    申请/专利号FR19940012667

  • 发明设计人 YOSHIMICHI OTSUKI;

    申请日1994-10-24

  • 分类号H01L21/265;H01L21/336;

  • 国家 FR

  • 入库时间 2022-08-22 04:06:50

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