Logic array module for integrated circuit layout manufactured by integration technology

摘要

A logic array module, produced by integrated techniques for forming integrated circuits, encompasses a substrate on which are designed at least one linking field and outside of it active elements which serve for the input and output of signals and for expanding the scope of the linking field, and it is constructed of tracks (48, 56; 46, 54), arranged in the shape of columns and lines, which can be intercoupled on their crossing points (intersections) by activatable or deactivatable coupling elements (50, 58) that, depending on the status (state of connection) of a track, influence the status of a track that crosses the former so that logic linkages can be realized on the crossing track. In order to enable to form several logic linking planes within the same linking structure, the coupling elements (50, 58) of the linking field are arranged so that at least two linking matrices (44, 52) are formed with parallel lines (46; 54) and columns (48; 56) in parallel among them, where the lines (46; 54) and columns (48; 56) of the one linking matrix (44; 52) cross the columns (56; 48) and lines (54; 46) of the other linking matrix (52; 44). Furthermore, there is at least one track (46, 48; 54, 56) of a linking matrix (44; 52) connectable with at least one track (54, 56; 46, 48) of the other connecting matrix (52; 44) by means of a connecting element (62).