COMPOSITION FOR PEELING ADHESIVE FROM CIRCUIT CONNECTED PART AND PEELING USING THE SAME

摘要

PURPOSE: To provide a composition for peeling, capable of efficiently peeling an adhesive at a part requiring a repair and excellent in connection reliability, and further to provide a method for the peeling. ;CONSTITUTION: An adhesive at an unnecessary part is removed and cleansed with a peeling composition comprising 100 pts.wt. of the solvent mixture of a nitrogen-containing organic solvent with a ketone organic solvent having a boiling point of ≥110°C or an oxygen-containing organic solvent having a boiling point of ≥110°C and 0.5-50 pts.wt. of a porous fine powdery material insoluble in the solvents.;COPYRIGHT: (C)1996,JPO