PURPOSE:To assemble passive parts such as capacitors by the same handling as active parts wherein chips as semiconductor integrated circuit devices are contained and to obtain a module wherein the planar packaging density is not decreased by arranging the passive units and active units which are standardized as the same unit on a board as the same arrangement. CONSTITUTION:A plurality of active parts containing chips as semiconductor integrated circuit devices and a plurality of passive elements such as capacitors are arranged on the same board. Thus, a semiconductor integrated circuit module 13 is constituted. The chips are sealed in a specified package. The active unit 2 is constituted as a standardized unit. The passive unit 8 is standardized as the same unit as said active unit 2 from said passive part by using specified members. Said active units 2 and passive units 8 are arranged on boards 3 as the same arrangement. For example, the memory ICs 2 and the capacitor arrays 8 which are standardized as the same unit as the memory ICs 2 are arranged between the printed boards 3 by the same arrangement, and the memory module 13 is constituted.
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