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haiburitsudo optical integrated circuit assembly device

机译:haiburitsudo光集成电路组装装置

摘要

PURPOSE:To considerably shorten the time required for positioning based on monitor of optical coupling efficiency by leading out an electrode from a pickup which holds an optical element chip. CONSTITUTION:A manipulator 40 is provided with a pickup 41 which attracts and holds an optical element chip 4 at the front end, a pickup holder 42 which holds the base part of the pickup 41, and an arm part 43 whose front end the pickup holder 42 is fixed to, and the pickup 41 is provided in the front end part of the arm part 43 by a wire 47 for electric wiring and is connected to an electrode leading-out terminal. Since the electrode is led out from the pickup holding the optical element chip, the optical coupling efficiency between an optical waveguide and optical elements is monitored during the positioning process at the time of making optical elements into a hybrid optical integrated circuit even if these optical elements are not completely electrically wired and are in the bare chip state, and optical elements are positioned with a high precision and are fixed on a substrate.
机译:目的:通过从装有光学元件芯片的拾波器中引出电极,大大缩短基于监视光耦合效率的定位所需的时间。构成:机械手40包括:一个拾波器41,其在前端吸引并保持光学元件芯片4;拾波器支架42,其保持拾波器41的基部;以及臂部43,该臂部的前端是拾波器支架拾取器41被固定在其上,并通过用于配线的电线47而被固定在臂部43的前端部,并与电极引出端子连接。由于从保持有光学元件芯片的拾取器中引出电极,因此即使在将这些光学元件制成混合型光集成电路的情况下,在定位过程中也能够监视光波导与光学元件之间的光耦合效率。它们没有完全电连接并且处于裸芯片状态,并且光学元件以高精度定位并且固定在基板上。

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