Circuit board, electronic devices embedded board, integrated circuit devices, integrated circuits with optical waveguides, electronic devices embedded board assembly methods

摘要

PPROBLEM TO BE SOLVED: To provide a method of miniaturizing an integrated circuit formed by packaging chip-type electronic devices in a multi-layered board, increasing the number of packaged chip-type electronic devices, and achieving cost reduction. PSOLUTION: There are provided a board 1 with built-in electronic devices in which chip-type electronic devices 4 are assembled in device packaging holes 31 formed in a circuit board 3, the circuit board 3 in which terminal portions 34 for energizing connections of the chip-type electronic devices 4 protrude in opening portions of the device packaging holes 31, a method for assembling the board 1 with built-in electronic devices, and an optical waveguide 10 with an integrated circuit using the board 1 with built-in electronic devices. PCOPYRIGHT: (C)2010,JPO&INPIT