MANUFACTURE OF THIN-FILM CIRCUIT BY PERIODIC REVERSE ELECTROLYZING METHOD AND THIN-FILM CIRCUIT BOARD, THIN-FILM MULTILAYER CIRCUIT BOARD AND ELECTRONIC CIRCUIT DEVICE USING THE SAME

摘要

PURPOSE: To make it easy to make a thin-film circuit multilayered and to improve a component density sharply by applying electroplating to a dielectric surface of the thin-film circuit by a periodic reverse electrolyzing method. ;CONSTITUTION: When a current ic on the minus side flows, a phenomenon of cathode electric deposition (deposition of a plating film) is brought about on a base holder and a base. When a current ia on the plus side flows, on the other hand, a phenomenon of cathode dissolution (dissolution of the plating film) is brought about. According to this periodic reverse electrolyzing method, in other words, the deposition of the plating film proceeds on the surface of the base during a time T_c when a cathode current flows, while the dissolution of the plating film proceeds on the surface of the base during a time T_a when an anode current flows. For instance, a waveform of (b) is obtained by putting prescribed pauses T₁ and T behind a cathode current pulse and an anode current pulse in an inverted pulse waveform of (a) respectively. Fig. (c) shows an asymmetrical sine wave (AC-DC superimposed wave) and the rise and fall of a current are gentle therein.;COPYRIGHT: (C)1995,JPO