MANUFACTURING METHOD FOR LOW-DIELECTRIC CONSTANT RESIN INSULATING LAYER, AND MANUFACTURING METHOD FOR CIRCUIT BOARD USING THE INSULATING LAYER AS WELL AS MANUFACTURING METHOD FOR THIN-FILM MULTILAYER CIRCUIT USING THE INSULATING LAYER

摘要

PROBLEM TO BE SOLVED: To reduce the dielectric constant of a resin insulating layer by making the resin insulating layer to be fine porous without lowering the strength, and to realize a circuit board and a thin film multilayer circuit film using the low- dielectric constant resin insulation layer as well as to reduce delay of signal propagation in a manufacturing method for the low-dielectric constant resin insulation layer, and a manufacturing method for the circuit board using the insulating layer as well as a manufacturing method for the thin film multilayer circuit film using the insulating layer.;SOLUTION: After an insulating layer 4 composed of polyimide is formed on a silicon wafer 1, particles 6 of Cu are diffused. By chemically etching the particles 6 of Cu, fine holes are formed to make the insulating layer to be porous.;COPYRIGHT: (C)2002,JPO