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Bump structure and method for forming bumps Bump structure and method for forming bumps
Bump structure and method for forming bumps Bump structure and method for forming bumps
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机译:凸块结构和形成凸块的方法凸块结构和形成凸块的方法
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摘要
The invention relates to a contact bump structure formed onto an aluminium contact pad area (3) on a silicon substrate (1) and a method of forming said contact bump structure. According to the invention, said contact bump structure comprises a tin bump (8) formed by means of an autocatalytic reaction on said contact pad area (3).
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