BUMP STRUCTURE SEMICONDUCTOR PACKAGE INCLUDING THE BUMP STRUCTURE AND METHOD OF FORMING THE BUMP STRUCTURE

摘要

According to a bump structure forming method, an under bump metal (UBM) layer can be formed on a pad of a semiconductor chip. A pillar bump can be formed on the UBM layer. A photoresist pattern including an outer surface of the pillar bump and an opening exposing a part of the UBM layer can be formed on the UBM layer. A capping film can be formed in the opening of the photoresist pattern. Therefore, a height, at which a bonding force between the pillar bump and a package substrate can be maintained, can be accurately imparted while suppressing stress applied to a metal wire in the semiconductor chip in the capping film.