Probe card with array of probe tips forming fine inclination angle

摘要

The present invention relates to a probe card (probe card), the device for inspecting the semiconductor in the state of the completed wafer, in particular to arrange the probe tip in contact with the pad of the wafer to have a slight fine inclination angle from the vertical and fixed to the probe tip Inserted through the guide hole perforated in the array, the conductor portion of the probe tip is shortened so that many chips with a large number of pads can be inspected at a time, and when the probe tip is in contact with the pad, it makes stable contact with the center of the pad. The present invention relates to a probe card having an array structure of probe tips having a fine inclination angle to maximize the inspection efficiency of a wafer while maintaining elasticity from pressure due to repeated contact with a pad.;Specific means of the present invention is a reinforcing plate 54 formed in the center of the upper surface of the printed circuit board 52, the circuit is configured, and a fault board for supporting and fixing the probe tip 56 in the center of the bottom surface of the printed circuit board 52 ( 58 is a probe card 50 configured to fix the probe tip 56 to the fixing plate 58 by an insulator 60, the guide holes having the same inclination angle in one direction to the fixing plate 58 in one direction. Punctures (58a), forms an inclined portion (56b) of the probe tip 56 having the same inclination angle as the guide hole (58a) to insert the inclined portion (56b) into the guide hole (58a), Each probe tip 56 is positioned in the direction of the circuit portion of the printed circuit board 52 to be adhesively fixed with the insulator 60 and soldered to the remaining exposed portion of the probe tip 56, that is, the printed circuit board 52. It is characterized by being insulated except for the part.