Carrier made of plastic for an electronic circuit with bondable contact pins

摘要

A plastic substrate (1) for electronic circuits has contact pins (5) which extend through the substrate (1) and have a bondable section (8) at the first side (24) of the substrate (1). The bondable section (8) serves to connect the circuit by means of wires that are connected by bonding to the contact pins (5) which project from a second side of the substrate (1) opposite to the first side (24). The contact pins (5) are U-shaped at one end, forming two legs (6, 7) of different lengths interconnected by the bondable section (8). The longer leg (6) extends through the substrate (1) and the shorter leg (7) only penetrates into the substrate (1).