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Schottky junction device having a Schottky junction of a semiconductor and a metal

机译:具有半导体和金属的肖特基结的肖特基结器件

摘要

To provide a Schottky junction device having a super-lattice arranged in the Schottky interface in order to secure a high Schottky barrier and at the same time showing a high speed response by resolving the phenomenon of piled-up holes at the upper edge of the valence band, while maintaining the height of the Schottky barrier. A Schottky junction device having a Schottky junction of a semiconductor and a metal and a superlattice on the interface of the semiconductor and the metal, wherein the upper edge of the valence band of said superlattice is varied to show a turn to a specific direction. The phenomenon of hole-piling up at the upper end of the valence band is resolved while maintaining the height of the Schottky barrier and consequently such a Schottky junction device shows an excellent high speed response.
机译:提供一种肖特基结装置,该肖特基结装置具有布置在肖特基界面中的超晶格,以确保高肖特基势垒,并同时通过解决化合价上缘的孔洞堆积现象而显示出高速响应。带,同时保持肖特基势垒的高度。肖特基结器件,其具有半导体和金属的肖特基结以及在半导体和金属的界面上的超晶格,其中,所述超晶格的价带的上边缘变化以显示转向特定方向。在保持肖特基势垒的高度的同时,解决了价带上端的空穴堆积现象,因此,这种肖特基结器件表现出优异的高速响应。

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