FINE GOLD ALLOY WIRE FOR BUMP, AND GOLD ALLOY BUMP

摘要

PROBLEM TO BE SOLVED: To provide a gold alloy bump and a fine gold alloy wire, having high reliability, for use in the formation of a stud bump used for connection of semiconductor devices. ;SOLUTION: In the gold alloy bump and the fine gold alloy wire for bump, Si is essentially contained to reduce bump height 9 and trace elements for reduction of height dispersion and improvement of joining property are further added. Moreover, Mn is incorporated by 0.005-0.8wt.% for the improvement of reliability of joining and the balance is composed of gold with inevitable impurities. Further, as elements for combined addition, 0.005-5wt.%, in total, of at least one element among Cu, Pd, and Pt (a first group), 0.0005-0.05wt.%, in total, of In, Sc, Ga, and Al, and 0.0002-0.03wt.%, in total, of Ca, Be, La, Ce, and Y are incorporated.;COPYRIGHT: (C)1997,JPO