METHOD FOR PEELING IC CHIP AND PEELING JIG USED FOR THE METHOD

摘要

PROBLEM TO BE SOLVED: To facilitate the peeling of IC chips from a substrate without impairing the IC chips and the circuit on the substrate by using a specified method. ;SOLUTION: A method for peeling off a pair of IC chips connected to a substrate with an adhesive from the substrate, wherein a peeling jig having a tapered sharp edge is inserted into the connecting part between the substrate and the IC chips to apply a shear stress to the IC chips on the substrate to thereby peel off the IC chips from the substrate. More specifically, the substrate is placed and fixed on a heating source heated to 150-250°C, and after heating for a prescribed time, a shear stress is applied to the connecting part on the lower side of the IC chip from one direction with the tip of the peeling jig. The angle of inclination of the jig is required to be less than 45°, preferably less than 10°.;COPYRIGHT: (C)1997,JPO